Thermal Solution
TE Connectivity’s Thermal Bridge Technology is an advanced thermal management solution offering up to twice the thermal resistance performance compared to traditional options like gap pads or thermal pads. Designed to address the challenges of rising power demands and limited airflow conditions, it provides an efficient, long-lasting solution for high-power applications.
Key Features
- Up to 2x better thermal resistance than conventional gap pads or thermal pads
- Elastic compression design for enhanced reliability and reduced material set or relaxation over time
- Consistent thermal performance over a longer service life
- Supports applications with restricted airflow, liquid cooling, or cold plate requirements
Application
- High-power electronic systems
- Systems with limited airflow cooling
- Liquid-cooled and cold plate thermal management systems
- Industrial, data center, and communication equipment requiring efficient heat dissipation
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